This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ibiden Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Masashi Umetsu: Innovator in Wiring Substrate Technology
Introduction
Masashi Umetsu is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrate technology, showcasing his expertise through his innovative patent.
Latest Patents
Umetsu holds a patent for a wiring substrate and method for manufacturing the same. This invention includes insulating layers, conductive layers, and a unique coating film that enhances adhesion between the conductive layer and the insulating layer. The design features a via conductor that connects the pad and the second conductive layer, with specific surface roughness parameters to optimize performance. His patent is a testament to his commitment to advancing technology in this area.
Career Highlights
Umetsu is currently employed at Ibiden Corporation, where he continues to develop innovative solutions in wiring substrate technology. His work has positioned him as a key player in the industry, contributing to the company's reputation for excellence.
Collaborations
Umetsu has collaborated with talented coworkers, including Kentaro Wada and Koji Kondo. Their combined efforts have led to advancements in their field, fostering a collaborative environment that encourages innovation.
Conclusion
Masashi Umetsu's contributions to wiring substrate technology through his patent and work at Ibiden Corporation highlight his role as an influential inventor. His dedication to innovation continues to shape the industry and inspire future advancements.