Aichi, Japan

Masashi Inaishi

This inventor holds 1 USPTO granted patent. Top assignee: Ngk Spark Plug Company, Limited. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masashi Inaishi. Retrieved from https://idiyas.com/inventor/masashi-inaishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Masashi Inaishi: Innovator in Circuit Board Technology

Introduction

Masashi Inaishi is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of circuit board technology, particularly with his innovative designs that enhance the functionality and reliability of electronic components.

Latest Patents

Masashi Inaishi holds a patent for a circuit board having solder bumps. This invention features a circuit board equipped with a plurality of solder bumps that are flattened and leveled at the tops. The coplanarity of the solder bumps is maintained at 0.5 µm or less per 1 mm. The flattened and leveled tops of the solder bumps are achieved through methods such as cold pressing, hot pressing, or grinding. Additionally, the patent includes methods for forming these solder bumps and the jigs used in the process.

Career Highlights

Inaishi is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the quality and performance of circuit boards used in various electronic applications.

Collaborations

Masashi Inaishi has collaborated with notable colleagues, including Haruhiko Murata and Yukihiro Kimura. Their combined expertise has contributed to the successful development of innovative technologies within their field.

Conclusion

Masashi Inaishi's contributions to circuit board technology exemplify the spirit of innovation. His patent for solder bumps showcases his commitment to enhancing electronic component design. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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