Masaru Mitsumoto

Title: Masaru Mitsumoto: Innovator in Printed Substrate Manufacturing

Introduction

Masaru Mitsumoto is a notable inventor based in Ryugasaki, Japan. He has made significant contributions to the field of printed substrate manufacturing, particularly through his innovative patent that enhances the efficiency of semiconductor chip loading.

Latest Patents

Mitsumoto holds a patent for "Printed substrate manufacturing equipment and manufacturing method." This invention involves the formation of solder bumps on multiple electrode parts of a printed substrate, allowing for the loading of a semiconductor chip via these solder bumps. A thermoplastic film is utilized as an underfill, covering the surface of the printed substrate where the solder bumps are formed. The film is designed with specific cutouts corresponding to the solder bumps, and it features a protruded edge where the semiconductor chip is placed. After the substrate is covered with the film, it is bonded to the board, and the semiconductor chip is loaded before being carried into a reflow furnace. In this furnace, heat and pressure are applied to fuse the solder bumps, ensuring a secure connection.

Career Highlights

Mitsumoto's career is marked by his work at Hitachi, Ltd., where he has been able to apply his innovative ideas in practical settings. His expertise in printed substrate technology has positioned him as a key figure in advancing manufacturing processes within the semiconductor industry.

Collaborations

Throughout his career, Mitsumoto has collaborated with esteemed colleagues such as Noriaki Mukai and Makoto Homma. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Masaru Mitsumoto's contributions to printed substrate manufacturing exemplify the impact of innovation in the semiconductor industry. His patent not only enhances manufacturing efficiency but also showcases the importance of collaboration in technological advancements.