Company Filing History:
Years Active: 2010-2011
Title: Masao Yoshimuta: Innovator in Silicon Wafer Manufacturing
Introduction
Masao Yoshimuta is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the production of silicon wafers. With a total of 2 patents to his name, Yoshimuta's work has advanced the technology used in the electronics industry.
Latest Patents
Yoshimuta's latest patents focus on innovative methods for manufacturing silicon wafers. One of his notable inventions describes a method characterized by performing one or both of grinding and polishing on a thin discoid silicon wafer. This process results in bowl-shaped warpage that is concave at the central part of the wafer surface. The method involves adsorbing and holding one main surface of the wafer while grinding or polishing the other main surface. This technique allows for the fabrication of either a convex wafer, whose thickness increases from the outer periphery toward the center, or a concave wafer, whose thickness decreases in the same manner. The process ultimately leads to the production of an SOI wafer or an epitaxial silicon wafer with a high degree of flatness.
Career Highlights
Yoshimuta is currently associated with Sumco Corporation, a leading company in the semiconductor industry. His work at Sumco has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in silicon wafer technology.
Collaborations
Yoshimuta has collaborated with notable colleagues such as Shinichi Tomita and Yasuyuki Hashimoto. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the field.
Conclusion
Masao Yoshimuta's contributions to silicon wafer manufacturing exemplify the spirit of innovation in the semiconductor industry. His patents reflect a commitment to enhancing the quality and efficiency of wafer production, making a lasting impact on technology.