Masao Kumura

Title: Masao Kumura: Innovator in Semiconductor Technology

Introduction

Masao Kumura is a prominent inventor based in Nara, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative work has advanced the efficiency and functionality of semiconductor devices.

Latest Patents

Kumura's latest patents include a method for lead electrode connection in a semiconductor device. This invention involves bonding raised contacts within a semiconductor chip to respective external leads using a specialized bonding tool. The design compensates for variations in surface temperature, enhancing the reliability of the connections. Another notable patent is for a flat-shaped semiconductor encapsulation. In this design, electrodes are formed on one major surface of a semiconductor chip and connected to lead electrodes on a support substrate. A cover plate, made of flexible glass cloth impregnated with half-cured epoxy resin, is fixed to the opposing surface, while the remaining surfaces are encapsulated by a resin mold.

Career Highlights

Kumura is associated with Sharp Kabushiki Kaisha Corporation, where he has been instrumental in developing cutting-edge semiconductor technologies. His work has not only contributed to the company's success but has also influenced the broader industry.

Collaborations

Throughout his career, Kumura has collaborated with notable colleagues, including Masao Hayakawa and Takamichi Maeda. These partnerships have fostered innovation and have led to the successful development of various semiconductor technologies.

Conclusion

Masao Kumura's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to impact the industry positively, paving the way for future advancements.