Masao Ida

Title: Masao Ida: Innovator in Integrated Circuit Packaging

Introduction

Masao Ida is a prominent inventor based in Tokyo, Japan. He is known for his significant contributions to the field of integrated circuit packaging. His innovative designs have paved the way for advancements in electronic devices, particularly in high-frequency applications.

Latest Patents

Masao Ida holds a patent for an improved integrated circuit package of the MLCP type. This design is suitable for use at high operating frequencies and with chips that dissipate large amounts of power. The patent details a unique configuration where electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces. The power transmitting wirings are formed on the entire peripheries of dedicated ceramic plates. Additionally, termination resistors for the signal wirings are formed on the same ceramic plates that contain the power supplying wirings. This innovative approach enhances the performance and reliability of integrated circuits.

Career Highlights

Throughout his career, Masao Ida has worked with notable companies, including Nippon Telegraph and Telephone Corporation and Sumitomo Electric Industries, Limited. His experience in these organizations has contributed to his expertise in the field of electronics and integrated circuit design.

Collaborations

Masao Ida has collaborated with esteemed colleagues such as Tomoji Goto and Akira Ohtsuka. These partnerships have fostered a creative environment that has led to groundbreaking innovations in integrated circuit technology.

Conclusion

Masao Ida's contributions to integrated circuit packaging have made a lasting impact on the electronics industry. His innovative designs continue to influence the development of high-performance electronic devices.