Tokyo, Japan

Masao Chida

This inventor holds 1 USPTO granted patent. Top assignee: Nec Engineering, Ltd.. Active years: 2014.


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2014

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Masao Chida: Innovator in Film Application Technology

Introduction

Masao Chida is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of film application technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of film application processes.

Latest Patents

Masao Chida holds a patent for a "Film attachment apparatus and attachment method." This invention focuses on a film application apparatus that effectively removes a glue surface protective sheet from a separated film and applies the film to a panel. The apparatus includes a press stage that presses the film from above, a press unit that bends and raises the end part of the glue surface protective sheet from below, and an application head that holds the film while the protective sheet is primarily removed. Additionally, a removal tape is utilized to completely detach the glue surface protective sheet from the film.

Career Highlights

Chida is currently employed at NEC Engineering, Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing film application methods, making them more efficient and effective.

Collaborations

Chida collaborates with Syouji Mori, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Masao Chida's contributions to film application technology exemplify the spirit of innovation. His patent and ongoing work at NEC Engineering, Ltd. highlight his commitment to advancing this field.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…