Masanaru Hasegawa, based in Yawata, Japan, is a notable inventor with a remarkable portfolio of 9 patents. His work primarily focuses on advancements in the field of printed wiring boards, which are essential components in modern electronics. Hasegawa's expertise in this area has contributed significantly to the development of more efficient and reliable wiring technologies.

Latest Patents

Among his latest patents, Hasegawa has developed a pioneering method for producing printed wiring boards. This innovative method involves several key steps, including the perforation of through holes at predetermined positions in an adhesive insulator sheet. It utilizes a conductive material, such as conductive paste or metal balls, to fill these holes. Furthermore, Hasegawa's technique incorporates the transfer of conductive wiring patterns formed on releasable supporting sheets to the adhesive insulator sheet using heat and pressure. Simultaneously, it establishes interlayer via-connections via the conductive material filled in the through holes.

In addition, he has also patented a wiring board design that consists of predetermined wiring patterns formed on both sides of an insulation substrate, electrically interconnected by conductive material within the through holes. Notably, this insulation substrate is made of a resin-impregnated fibrous sheet complemented by a heat-resistant film. This invention addresses critical issues such as inadequate adhesion strength and limitations in the finesse of wiring patterns caused by surface irregularities during the thermocompression bonding process.

Career Highlights

Masanaru Hasegawa has spent a significant part of his career at Matsushita Electric Industrial Co., Ltd., where he has dedicated his efforts to advancing technologies in electronic components. His innovative spirit and commitment to research have allowed him to contribute substantially to the company’s reputation for quality and reliability in electronics manufacturing.

Collaborations

Throughout his career, Hasegawa has collaborated with talented individuals such as Hideo Hatanaka and Masahide Tsukamoto. These collaborations have further enhanced the innovative processes within Matsushita Electric and allowed for a more dynamic approach toward tackling challenges in printed wiring board technology.

Conclusion

Masanaru Hasegawa's contributions to the field of printed wiring boards exemplify the spirit of innovation and invention. His recent patents reflect a profound understanding of material science and engineering, aimed at improving the functionality and reliability of electronic devices. As technology continues to evolve, inventors like Hasegawa will undoubtedly play a crucial role in shaping the future of electronics.

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