Company Filing History:
2 out of 2,639 
2 out of 82 
Years Active: 1992-1994
Title: Masanao Kohno: Innovator in Circuit Board Technology
Introduction
Masanao Kohno is a notable inventor based in Kakogawa, Japan. He has made significant contributions to the field of circuit board technology, particularly in the area of solder-coated printed circuit boards. With a total of 2 patents to his name, Kohno's work has had a lasting impact on electronic manufacturing processes.
Latest Patents
Kohno's latest patents include innovative methods for manufacturing solder-coated printed circuit boards. One of his patents describes a process where a plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are designed to meet specific dimensional relationships, ensuring optimal performance. Another patent outlines a method of forming a solder layer on pads of a circuit board using a paste-like composition that includes a lead salt of an organic acid and tin powder. This method allows for the effective soldering of electronic components to the pads, enhancing the reliability of electronic devices.
Career Highlights
Throughout his career, Masanao Kohno has worked with prominent companies such as Furukawa Electric Co., Ltd. and Harima Chemicals, Incorporated. His experience in these organizations has contributed to his expertise in circuit board technology and soldering methods.
Collaborations
Kohno has collaborated with notable colleagues, including Kenichi Fuse and Takao Fukunaga. These partnerships have likely enriched his work and led to further advancements in the field.
Conclusion
Masanao Kohno's contributions to circuit board technology and soldering methods demonstrate his innovative spirit and dedication to improving electronic manufacturing processes. His patents reflect a deep understanding of the technical challenges in the industry and offer solutions that enhance the performance of electronic devices.