Aichi, Japan

Masami Takeda

This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masami Takeda. Retrieved from https://idiyas.com/inventor/masami-takeda-c6nndvxu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: Masami Takeda: Innovator in Welding Technology

Introduction

Masami Takeda is a notable inventor based in Aichi, Japan, recognized for his contributions to welding technology. With a focus on improving manufacturing processes, Takeda's innovative work has contributed significantly to the field.

Latest Patents

Takeda holds a patent for the "Method of and apparatus for welding spring to aperture grill." This invention showcases his expertise and dedication to enhancing the quality and efficiency of welding applications, particularly in the context of manufacturing electronic components.

Career Highlights

Masami Takeda is employed by Sony Corporation, a leading multinational in the electronics industry. His role at Sony has provided him with a platform to develop and refine his innovative techniques, making important strides in the production process.

Collaborations

Throughout his career, Takeda has collaborated with talented coworkers such as Tomoyuki Kurihara and the accomplished Kazuhiko Otsuka. These partnerships have led to the exchange of ideas and the development of groundbreaking solutions in the realm of welding technology.

Conclusion

In summary, Masami Takeda stands out as an inventor committed to advancing welding methods, particularly with his patented invention. Through his work at Sony Corporation and collaborations with esteemed colleagues, he continues to contribute to the technological landscape, paving the way for future innovations in manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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