Tokyo, Japan

Masaki Oota

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: 3M Innovative Properties Company. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaki Oota. Retrieved from https://idiyas.com/inventor/masaki-oota

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Masaki Oota - Innovator in Heat Conductive Technology

Introduction

Masaki Oota is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of heat conductive materials. His work focuses on developing solutions that enhance thermal management in various applications.

Latest Patents

Masaki Oota holds a patent for a heat conductive sheet. This invention provides a heat conductive sheet that can maintain high heat conductivity and flexibility across a long period of time, even in high-temperature environments. The heat conductive sheet includes a (meth)acrylate polymer, a trimellitate ester plasticizer, a first antioxidant with a hindered phenol backbone, and a second antioxidant with a thioether backbone.

Career Highlights

Masaki Oota is associated with 3M Innovative Properties Company, where he continues to push the boundaries of material science. His work has significantly impacted the development of advanced thermal management solutions.

Collaborations

Masaki Oota collaborates with Kentaro Tamura, leveraging their combined expertise to drive innovation in their projects.

Conclusion

Masaki Oota's contributions to heat conductive technology exemplify the importance of innovation in material science. His patent reflects a commitment to enhancing performance in high-temperature applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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