Aichi, Japan

Masaki Morinaka

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sakura Rubber Co., Ltd.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaki Morinaka. Retrieved from https://idiyas.com/inventor/masaki-morinaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Masaki Morinaka: Innovator in Honeycomb Sandwich Panel Technology

Introduction

Masaki Morinaka is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of materials engineering, particularly with his innovative designs in sandwich panel technology. His work has implications for various industries, including construction and aerospace.

Latest Patents

Morinaka holds a patent for a honeycomb sandwich panel. This invention features a honeycomb core, with a front surface layer and a rear surface layer sandwiching the core on its upper and lower surfaces. Notably, at least one of these layers is made of a fiber reinforced plastic that utilizes a phenolic resin as a matrix. This design enhances the structural integrity and performance of the panel.

Career Highlights

Masaki Morinaka is associated with Sakura Rubber Co., Ltd., where he has been instrumental in developing advanced materials. His expertise in composite materials has positioned him as a key figure in the company, contributing to its reputation for innovation.

Collaborations

Morinaka has worked alongside his coworker, Makoto Chujo, to further enhance the capabilities of their products. Their collaboration has led to advancements in the application of honeycomb structures in various fields.

Conclusion

Masaki Morinaka's contributions to the field of sandwich panel technology exemplify the importance of innovation in material science. His patent for the honeycomb sandwich panel showcases his commitment to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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