Yamaguchi, Japan

Masaki Kohsaka


Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1991-1996

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2 patents (USPTO):Explore Patents

Title: Masaki Kohsaka: Innovator in Packaging Technology

Introduction

Masaki Kohsaka is a notable inventor based in Yamaguchi, Japan. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work focuses on developing advanced materials that enhance the performance and sustainability of packaging solutions.

Latest Patents

Kohsaka's latest patents include a packaging laminate material and polyester carbonate copolymers. The packaging laminate material comprises a paper substrate and a polyester resin layer, which provides high heat-sealing strength and excellent scent retention properties. This innovative material is designed to withstand hot water and hydrogen peroxide treatments without significant loss of strength. His second patent involves polyester carbonate copolymers, which are created from a mixture of alkylene terephthalate oligomers and carbonate oligomers. These copolymers exhibit remarkable transparency, heat resistance, and mechanical strength, making them suitable for various applications.

Career Highlights

Throughout his career, Masaki Kohsaka has worked with prominent companies such as Mitsui Petrochemical Industries, Ltd. and Nippon Paper Industries Co., Ltd. His experience in these organizations has allowed him to refine his expertise in polymer science and packaging technology.

Collaborations

Kohsaka has collaborated with notable colleagues, including Isaburou Higashi and Yoshinori Akana. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Masaki Kohsaka's innovative work in packaging technology has led to the development of materials that improve performance and sustainability. His contributions continue to influence the industry and pave the way for future advancements.

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