Nara, Japan

Masaki Hayama

This inventor holds 1 USPTO granted patent. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaki Hayama. Retrieved from https://idiyas.com/inventor/masaki-hayama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Masaki Hayama: Innovator in Module Component Technology

Introduction

Masaki Hayama is a notable inventor based in Nara, Japan. He has made significant contributions to the field of electronics through his innovative designs and patents. His work primarily focuses on enhancing the reliability and compactness of module components used in various electronic devices.

Latest Patents

Hayama holds a patent for a module part that includes a circuit substrate with one or more components on at least one of its surfaces. This patent describes a junction circuit substrate that has hollow or hole features corresponding to the components mounted on the circuit substrate. The design allows for the substrates to be laminated into a single body, ensuring that the mounted components are contained within. This configuration enhances the reliability of layer-to-layer connections and enables the dense mounting of multiple components with high dimensional accuracy. Thus, Hayama's invention offers a highly reliable and compact module component.

Career Highlights

Masaki Hayama is associated with Matsushita Electric Industrial Co., Ltd., a company known for its advancements in electronic technology. His work at this esteemed organization has allowed him to push the boundaries of innovation in module components.

Collaborations

Hayama has collaborated with notable colleagues such as Hiroshi Higashitani and Takeo Yasuho. Their combined expertise has contributed to the development of cutting-edge technologies in the field.

Conclusion

Masaki Hayama's contributions to module component technology exemplify the spirit of innovation in the electronics industry. His patent reflects a commitment to enhancing reliability and efficiency in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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