Company Filing History:
Years Active: 2019-2020
Title: Masakazu Yatou: Innovator in Semiconductor Technology
Introduction
Masakazu Yatou is a prominent inventor based in Kariya, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for substrate bonding and the development of physical quantity sensing devices.
Latest Patents
One of Yatou's latest patents is a substrate bonding method. This method involves preparing a first substrate with a silicon oxide film of 50 nm or more and a second substrate with a silicon oxide film of 2.5 nm or less. The two substrates are bonded together with their silicon oxide films facing each other, followed by heating at temperatures between 200°C and 800°C.
Another notable patent is for a physical quantity sensing semiconductor device and its manufacturing method. This device features a first substrate with a sensing unit for a physical quantity and multiple diffusion wiring layers. An air-tight chamber is created between the first and second substrates, sealing the sensing unit within it. The design ensures that the outer edge of the first substrate maintains a constant impurity concentration.
Career Highlights
Masakazu Yatou is currently employed at Denso Corporation, a leading company in the automotive technology sector. His work at Denso has allowed him to apply his innovative ideas in practical applications, contributing to advancements in semiconductor technology.
Collaborations
Yatou has collaborated with notable coworkers, including Kouhei Yamaguchi and Minoru Murata. Their combined expertise has fostered a productive environment for innovation and development within their projects.
Conclusion
Masakazu Yatou's contributions to semiconductor technology through his patents and work at Denso Corporation highlight his role as a key innovator in the field. His advancements in substrate bonding methods and sensing devices continue to influence the industry.