This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: The Furukawa Electric Co., Ltd.. Active years: 2024-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2025
Title: Masakazu Isemura: Innovator in Heat Pipe Technology
Introduction
Masakazu Isemura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal management through his innovative designs and patents. With a focus on heat pipe structures and manufacturing methods, Isemura has established himself as a key figure in this specialized area of technology.
Latest Patents
Isemura holds 2 patents that showcase his expertise in heat pipe technology. His latest patents include a heat pipe structure and a heat sink, along with their respective manufacturing methods. The heat pipe structure features a base block designed to accommodate a heat receiving tubular portion, which is caulked and fixed within a recessed part. This design incorporates a first metal part that has a melting point between 130° C and 400° C. Additionally, the heat pipe structure includes a base block that thermally connects to a heat generating body, enhancing its efficiency in thermal management.
Career Highlights
Isemura is associated with The Furukawa Electric Co., Ltd., where he has contributed to various projects related to heat management solutions. His work has been instrumental in advancing the technology used in heat pipes, which are critical for efficient thermal regulation in electronic devices.
Collaborations
Throughout his career, Isemura has collaborated with notable colleagues, including Chiyoshi Sasaki and Takahiro Katayama. These partnerships have fostered innovation and have led to the development of advanced thermal management technologies.
Conclusion
Masakazu Isemura's contributions to heat pipe technology reflect his dedication to innovation and excellence. His patents and collaborative efforts continue to influence the field, making him a significant figure in thermal management solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
