Kawaguchi, Japan

Masakazu Fujiwara


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Masakazu Fujiwara: Innovator in Photosensitive Thermosetting Resin Technology

Introduction

Masakazu Fujiwara is a notable inventor based in Kawaguchi, Japan. He has made significant contributions to the field of materials science, particularly in the development of photosensitive thermosetting resin compositions. His innovative work has implications for various applications, including flexible printed circuit boards.

Latest Patents

Masakazu Fujiwara holds a patent for a photosensitive thermosetting resin composition and a flexible printed circuit board. This invention provides a halogen-free coating film with high-level flame retardancy. The resin composition is designed to exhibit superior low warpage properties after curing, along with excellent plasticity, resolution, soldering heat resistance, and chemical resistance. The composition includes a resin component with a (meth)acryloyl group and a carboxyl group, a phosphorus-containing epoxy thermosetting resin, a photopolymerization initiator, an organophosphorus compound, and a diluent. This innovative formulation addresses the issues associated with conventional photosensitive thermosetting resin compositions that utilize brominated epoxy resin and halogen-based flame retardants.

Career Highlights

Masakazu Fujiwara is currently associated with Kyocera Chemical Corporation, where he continues to advance his research and development efforts. His work has garnered attention for its potential to enhance the performance and safety of electronic components.

Collaborations

He has collaborated with notable colleagues, including Tetsuya Ezaki and Masanobu Yanahara, contributing to the advancement of their shared goals in materials innovation.

Conclusion

Masakazu Fujiwara's contributions to the field of photosensitive thermosetting resin technology exemplify the impact of innovative thinking in materials science. His work not only addresses current challenges but also paves the way for future advancements in flexible electronics.

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