Oi, Japan

Masakatsu Tanji

This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masakatsu Tanji. Retrieved from https://idiyas.com/inventor/masakatsu-tanji

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Masakatsu Tanji: Innovator in Circuit Board Technology

Introduction

Masakatsu Tanji is a notable inventor based in Oi, Japan. He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique circuit board packaging structure.

Latest Patents

Tanji holds a patent for a circuit board packaging structure. This invention allows for the insertion and extraction of an interface part of a circuit board into and from a connector part of processing equipment in a direction different from the direction of attaching and detaching the circuit board. The structure includes an operating part that turns on receiving force, a plate part that is fixed to the circuit board and is rotatable, a link part that connects the operating part with the plate part, and a fastener that secures the circuit board and the operating part with play. He has 1 patent to his name.

Career Highlights

Tanji is currently employed at Hitachi, Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing circuit board design and functionality.

Collaborations

One of his notable collaborators is Yoshito Hayashi. Together, they have worked on various projects that enhance the capabilities of circuit board technology.

Conclusion

Masakatsu Tanji's contributions to circuit board technology exemplify his innovative spirit and dedication to advancing the field. His patent for a circuit board packaging structure showcases his ability to solve complex engineering challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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