Takarazuka, Japan

Masahiro Takeda

This inventor holds 1 USPTO granted patent. Top assignees: Hitachi Zosen Corporation, Settsu Corporation. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masahiro Takeda. Retrieved from https://idiyas.com/inventor/masahiro-takeda-r6f3n5bn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Masahiro Takeda: Inventor of a Cushioning-Material Molding Method.

Introduction

Masahiro Takeda is an inventor associated with Takarazuka, Japan. His patent work addresses the compressive molding of cushioning material made from fiberized paper or pulp. He is credited with 1 patent.

Latest Patents

Takeda’s listed patent, “Method and Apparatus for Compressively Molding Cushioning Material,” describes a process for forming cushioning material from dry, fibrous raw material. The apparatus uses a quadrangular cylindrical molding box with a receiver mold closing one end. A compressive mold moves into the box from the opposite end, pressing the supplied material toward the receiver mold, while a core member retreats in coordination with that movement. This arrangement is designed to compress the thin core portion and the interior evenly, helping produce a molded body with consistent density.

Career Highlights

Takeda’s professional associations include Hitachi Zosen Corporation and Settsu Corporation. His patent reflects an application of mechanical molding techniques to the production of cushioning material from paper or pulp fibers.

Collaborations

Kiyohisa Ueda and Eiji Koyanagi are identified as Takeda’s coworkers.

Conclusion

Masahiro Takeda’s recorded invention focuses on a coordinated molding process intended to produce cushioning material with evenly compressed sections and consistent density.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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