Ibaraki, Japan

Masahiro Ohura



Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 157(Granted Patents)


Location History:

  • Osaka, JP (1996 - 2003)
  • Ibaraki, JP (2002 - 2008)

Company Filing History:


Years Active: 1996-2008

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15 patents (USPTO):Explore Patents

Title: Masahiro Ohura: Innovator in Adhesive Technology

Introduction

Masahiro Ohura is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of adhesive technology, holding a total of 15 patents. His work focuses on developing advanced adhesive compositions that enhance performance and usability.

Latest Patents

Ohura's latest patents include innovations such as a thermosetting adhesive or pressure-sensitive adhesive tape or sheet. This invention features a structure where a thermosetting adhesive layer is made from a composition containing an acrylic polymer and a phenol resin, protected by a release liner that does not contain a silicone component. Another notable patent is an acrylic pressure-sensitive adhesive composition that excels in adhesive characteristics and removability. This composition is created by copolymerizing specific alkyl esters and carboxyl group-containing monomers, combined with tackifier resins derived from natural products.

Career Highlights

Masahiro Ohura is currently employed at Nitto Denko Corporation, a leading company in the adhesive industry. His innovative work has positioned him as a key figure in the development of new adhesive technologies that meet the evolving needs of various applications.

Collaborations

Throughout his career, Ohura has collaborated with notable colleagues, including Takao Yoshikawa and Yasuyuki Tokunaga. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in adhesive technology.

Conclusion

Masahiro Ohura's contributions to adhesive technology through his numerous patents highlight his role as an influential inventor in the field. His work continues to impact the industry, paving the way for future innovations in adhesive applications.

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