Osaka, Japan

Masahiko Noda


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Masahiko Noda: Innovator in Binding Device Technology

Introduction

Masahiko Noda is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of binding technology, particularly with his innovative binding device. His work focuses on enhancing the durability and functionality of binding materials, especially those made from biodegradable substances.

Latest Patents

Masahiko Noda holds a patent for a binding device designed to prevent damage to binding tape. This device features a pressing surface that is formed on a resin attachment, which can be detachably mounted on the head of a tape holding plate. The design allows for the attachment of a shape and material that is suitable for the binding tape being used. Additionally, the tape receiving plate is constructed from a rubber plate, enabling it to absorb shocks generated by the pointed end of the tape holding plate. This innovative arrangement helps to protect fragile binding tape, including those made from biodegradable materials.

Career Highlights

Throughout his career, Masahiko Noda has worked with prominent companies such as Nichiban Company Limited and Microjenics Inc. His experience in these organizations has contributed to his expertise in developing advanced binding solutions.

Collaborations

Masahiko Noda has collaborated with talented individuals in his field, including Masanori Sato and Toru Katada. These partnerships have fostered innovation and creativity in the development of binding technologies.

Conclusion

Masahiko Noda's contributions to binding device technology highlight his commitment to innovation and sustainability. His patented device not only enhances the functionality of binding materials but also addresses environmental concerns by utilizing biodegradable components. His work continues to influence the industry and inspire future advancements in binding technology.

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