Sagamihara, Japan

Masafumi Yoshida

This inventor holds 1 USPTO granted patent. Top assignee: Sekisui Chemical Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masafumi Yoshida. Retrieved from https://idiyas.com/inventor/masafumi-yoshida-qau9d49b

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Masafumi Yoshida: Innovator in Heat-Dissipating Technologies

Introduction

Masafumi Yoshida is a prominent inventor based in Sagamihara, Japan. He is known for his innovative contributions to heat-dissipating technologies, particularly in the development of materials that effectively manage heat while maintaining electrical insulation.

Latest Patents

Yoshida holds a patent for a "Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member." This invention comprises a polymer matrix combined with diamond particles. The heat-dissipating composition is designed to satisfy the dual requirements of electric insulativity and heat dissipativity, making it a significant advancement in the field.

Career Highlights

Masafumi Yoshida is associated with Sekisui Chemical Co., Ltd., where he has made substantial contributions to the company's research and development efforts. His work focuses on creating materials that enhance thermal management in various applications.

Collaborations

Yoshida has collaborated with notable colleagues, including Masataka Sugimoto and Abison Scaria, to further advance the field of heat-dissipating technologies.

Conclusion

Masafumi Yoshida's innovative work in heat-dissipating materials exemplifies the importance of combining electrical insulativity with effective heat management. His contributions continue to influence advancements in technology and materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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