Company Filing History:
Years Active: 2008-2012
Title: Masaaki Yanaka: Innovator in Hard Coating and Circuit Wiring Technologies
Introduction
Masaaki Yanaka is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of hard coating films and multilayer circuit wiring boards. With a total of 2 patents, Yanaka's work showcases his innovative spirit and technical expertise.
Latest Patents
Yanaka's latest patents include a hard coat film and a BGA-type multilayer circuit wiring board. The hard coat film features a hard coat layer formed by irradiating an acrylic acid derivative with ionizing radiation. This invention ensures that the absorption intensities of carboxylic acid groups and carbon double bonds meet specific numerical criteria, enhancing the film's performance. The BGA-type multilayer circuit wiring board is designed for direct mounting on printed wiring boards, ensuring reliable electrical connections through its innovative structure.
Career Highlights
Masaaki Yanaka is associated with Toppan Printing Co., Ltd., where he has been instrumental in developing advanced technologies. His work has not only contributed to the company's portfolio but has also pushed the boundaries of innovation in the industry.
Collaborations
Yanaka collaborates with Naomi Ogawa, leveraging their combined expertise to drive forward innovative projects and solutions.
Conclusion
Masaaki Yanaka's contributions to hard coating and circuit wiring technologies highlight his role as a key innovator in his field. His patents reflect a commitment to advancing technology and improving product reliability.
