The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Apr. 24, 2006
Masaaki Yanaka, Tokyo, JP;
Masaaki Yanaka, Tokyo, JP;
Toppan Printing Co., Ltd., , JP;
Abstract
Provided is a BGA-type multilayer circuit wiring board which is mounted on a printed wiring board directly via a solder ball with the electrode pad for solder ball connection formed thereon and in which the electric connection reliability of the filled via connected to the electrode pad for solder ball connection is not worsened. A wiring layer is formed on both surfaces of an insulating substrate; an electrode pad for solder bump for mounting a semiconductor chip thereon is formed on one surface of the substrate via an insulating layer; and an electrode pad for solder ball for connecting the structure to a printed wiring board is formed on the other surface thereof. The electrode pad for solder ball is electrically connected to the filled via; and the filled via is disposed in the intermediate position between the neighboring electrode pads for solder ball connection.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile