Ottawa, Canada

Maryam Abouie

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Canada Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Maryam Abouie. Retrieved from https://idiyas.com/inventor/maryam-abouie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Maryam Abouie: Innovator in Power Semiconductor Packaging

Introduction

Maryam Abouie is a prominent inventor based in Ottawa, Canada. She has made significant contributions to the field of power semiconductor devices, particularly in the area of embedded die packaging. Her innovative work has led to the development of a patented technology that enhances the performance and reliability of power semiconductor devices.

Latest Patents

Maryam holds a patent for a "Solder resist structure for embedded die packaging of power semiconductor devices." This invention addresses the challenges associated with high voltage and high temperature operations of power semiconductor devices. The patent describes a packaging method where a power semiconductor die is embedded within a package body that consists of dielectric and electrically conductive layers. An external dielectric coating, such as a solder resist coating, is applied to one or both sides of the package body. The design of the solder resist coating is crucial, as it avoids inside corners to prevent stress concentration and potential cracking during thermal cycling. This innovative layout significantly improves the durability of the packaging.

Career Highlights

Maryam Abouie is currently employed at Infineon Technologies Canada Inc., where she continues to advance her research and development efforts in semiconductor technology. Her work has been instrumental in enhancing the reliability and efficiency of power semiconductor devices.

Collaborations

Maryam collaborates with talented colleagues, including Ahmad Mizan and Cameron Mcknight-Macneil, who contribute to her projects and research initiatives. Their teamwork fosters a creative environment that drives innovation in the field.

Conclusion

Maryam Abouie's contributions to power semiconductor packaging exemplify her dedication to innovation and excellence. Her patented technology not only addresses critical challenges in the industry but also sets a new standard for reliability in semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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