Mary A Schaffer

Title: Mary A. Schaffer: Innovator in Wafer Technology

Introduction

Mary A. Schaffer is a notable inventor based in Hopewell Junction, NY (US). She has made significant contributions to the field of wafer technology, holding 2 patents that showcase her innovative spirit and technical expertise.

Latest Patents

One of her latest patents involves a shadow mask for depositing solder bumps. This invention includes additional dummy holes located adjacent to holes corresponding to most of the perimeter chips of the wafer. The additional dummy holes provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of these contacts. Furthermore, the extra holes allow for solder bumps outside the perimeter chips, which can support a second shadow mask for the deposition of additional materials, such as tin, on the reflowed solder bumps. This innovation facilitates the mounting of chips on a plastic substrate at low temperatures. Additionally, an improved mask-to-wafer alignment aid is formed from standard solder bumps, which avoids damage to test probes and provides improved course alignment.

Career Highlights

Mary A. Schaffer is currently employed at International Business Machines Corporation (IBM), where she continues to develop her groundbreaking technologies. Her work has had a lasting impact on the industry, particularly in enhancing the efficiency and reliability of wafer processing.

Collaborations

Throughout her career, Mary has collaborated with esteemed colleagues, including Harry David Cox and David P. Daniel. These partnerships have contributed to her success and the advancement of her innovative projects.

Conclusion

Mary A. Schaffer exemplifies the spirit of innovation in the field of wafer technology. Her contributions through her patents and collaborations have significantly advanced the industry, making her a prominent figure in her field.