Company Filing History:
Years Active: 1996-2014
Title: Inventor Marvin Wayne Cowens: Innovating Semiconductor Technology
Introduction
Marvin Wayne Cowens, a prolific inventor based in Plano, Texas, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of nine patents, Cowens has been a key player in the development of innovative methodologies that enhance the performance and reliability of semiconductor devices.
Latest Patents
Among Cowens' latest patents is a groundbreaking **Wire-based methodology of widening the pitch of semiconductor chip terminals**. This invention focuses on a packaged semiconductor device that incorporates a semiconductor chip featuring bond pads arranged in a specific pitch. The method utilizes metal wires to connect these pads to contact nodes in a staggered array, effectively widening the terminal pitch.
Another notable patent is the **Adhesion by plasma conditioning of semiconductor chip**. This patent describes a novel plasma conditioning method to improve adhesion between integrated circuit chips and insulating underfill materials. By exposing the polymer-coated surfaces of the chips to plasma in a controlled environment, this method enhances the chip's surface affinity, thereby increasing the adhesion to organic materials.
Career Highlights
Cowens has worked with renowned companies such as **Texas Instruments Corporation** and **Texas Systems Incorporated**, where he has been instrumental in advancing semiconductor technologies. His research and innovative approaches have shaped the way semiconductor devices are designed and manufactured.
Collaborations
Throughout his career, Cowens has collaborated with many talented professionals, including coworkers like **Charles Anthony Odegard** and **Masood Murtuza**. These collaborations have allowed him to broaden his knowledge and influence within the semiconductor industry, leading to numerous advancements in technology.
Conclusion
Marvin Wayne Cowens stands out as an innovative inventor in the semiconductor field, with nine patents that underscore his contributions to technology. His latest advancements in widening terminal pitches and enhancing adhesion through plasma conditioning demonstrate his commitment to improving semiconductor performance and reliability. Cowens’ work continues to inspire future inventors and positions him as a leading figure in the ongoing evolution of semiconductor technology.