The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
May. 02, 2005
Marvin W. Cowens, Plano, TX (US);
Masood Murtuza, Sugarland, TX (US);
Vinu Yamunan, Dallas, TX (US);
Charles Odegard, McKinney, TX (US);
Phillip R. Coffman, Rowlett, TX (US);
Marvin W. Cowens, Plano, TX (US);
Masood Murtuza, Sugarland, TX (US);
Vinu Yamunan, Dallas, TX (US);
Charles Odegard, McKinney, TX (US);
Phillip R. Coffman, Rowlett, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.