Marvin D Miller

Title: Marvin D. Miller: Innovator in High-Speed Interconnect Systems

Introduction

Marvin D. Miller is a notable inventor based in Palm Bay, FL (US). He has made significant contributions to the field of high-speed interconnect systems, holding a total of 2 patents. His work focuses on reducing crosstalk in interconnect systems, which is crucial for enhancing the performance of electronic devices.

Latest Patents

Marvin's latest patents include innovative systems and methods for providing a high-speed interconnect system with reduced crosstalk. These patents detail a process that involves forming a Core Substrate (CS) with a First Via (FV) and disposing a First Trace (FT) on the exposed surface of CS. The FT is in electrical contact with FV, and a first HDI substrate is laminated to CS, allowing FT to connect with a Second Via (SV) formed through the first HDI substrate. Additionally, a Second Trace (ST) is disposed on the first HDI substrate, connecting SV to a Third Via (TV) formed through a second HDI substrate. The design includes a buried via (SV) with a central axis that is spatially offset from the central axes of FV and SV, ensuring that FV and SV have diameters smaller than that of TV.

Career Highlights

Marvin D. Miller is currently employed at Eagle Technology, LLC, where he continues to innovate in the field of electronic interconnect systems. His expertise in high-speed interconnect technology has positioned him as a key player in the industry.

Collaborations

Some of Marvin's notable coworkers include Michael T. DeRoy and Andres M. Gonzalez, who contribute to the collaborative environment at Eagle Technology, LLC.

Conclusion

Marvin D. Miller's contributions to high-speed interconnect systems demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of electronic design and a drive to improve system performance.