Scarborough, Canada

Martin Leandro Par

This inventor holds 1 USPTO granted patent. Top assignee: Chinook Contract Research Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin Leandro Par. Retrieved from https://idiyas.com/inventor/martin-leandro-par-t08d3o9i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Martin Leandro Par - Innovator in Blister Packaging

Introduction

Martin Leandro Par is an accomplished inventor based in Scarborough, CA. He has made significant contributions to the field of packaging technology, specifically through his innovative designs that enhance product safety and convenience.

Latest Patents

Martin holds a patent for "Double-recessed blister packaging." This unique packaging design features two recesses that improve the protection and presentation of products, making it easier for consumers to access items while ensuring they remain securely stored.

Career Highlights

Currently, Martin is employed at Chinook Contract Research Inc., where he continues to apply his expertise in packaging solutions. His role involves not only developing new packaging designs but also improving existing ones to meet the evolving needs of the market.

Collaborations

Throughout his career, Martin has collaborated with various professionals in the research and development sector. His partnerships have played a crucial role in refining his designs and bringing innovative packaging solutions to the forefront.

Conclusion

Martin Leandro Par exemplifies the spirit of innovation with his patent achievements and contributions to the packaging industry. His work at Chinook Contract Research Inc. is a testament to his dedication to advancing technology in the realm of blister packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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