This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Schoeller Technocell Gmbh & Co. Kg. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Martin Goeppert: Innovator in Sublimation Printing Technology
Introduction
Martin Goeppert is a notable inventor based in Deutschland, DE. He has made significant contributions to the field of sublimation printing technology. His innovative approach has led to the development of a unique transfer material that enhances the dye sublimation process.
Latest Patents
Martin Goeppert holds a patent for a transfer material for sublimation printing based on paper as the carrier, which includes an ink blocking function. The invention relates to a transfer material for dye sublimation processes, comprising a base paper coated on one side with a color-receiving layer. The base paper contains at least 1.5% by weight of a polymer dispersion selected from polyacrylates, polyesters, polyolefins, or mixtures thereof. The process for producing this transfer material involves several steps, including the production of base paper, drying and smoothing, applying the color-receiving layer, and drying the final transfer material. This innovative material allows for the effective transfer of images onto receiving materials through sublimation.
Career Highlights
Martin Goeppert is associated with Schoeller Technocell GmbH & Co. KG, where he has been instrumental in advancing sublimation printing technologies. His work has not only contributed to the company's portfolio but has also set new standards in the industry.
Collaborations
Some of Martin's coworkers include Michael Jocher and Martina Wicher. Their collaborative efforts have further enhanced the development of innovative solutions in the field of sublimation printing.
Conclusion
Martin Goeppert's contributions to sublimation printing technology exemplify the impact of innovation in the industry. His patent and work at Schoeller Technocell GmbH & Co. KG highlight the importance of advancements in materials and processes.