Ray Township, MI, United States of America

Martin Aaron Butkovich

This inventor holds 1 USPTO granted patent. Top assignee: Gm Global Technolgoy Operations, Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin Aaron Butkovich. Retrieved from https://idiyas.com/inventor/martin-aaron-butkovich

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Martin Aaron Butkovich: Innovator in Thermoplastic Technology

Introduction

Martin Aaron Butkovich is a notable inventor based in Ray Township, MI (US). He has made significant contributions to the field of thermoplastic technology, particularly through his innovative patent.

Latest Patents

Butkovich holds a patent for "Powder Coated Vacuum Formed Articles." This patent describes a method of forming a thermoplastic plastic component that involves applying pigmented powder to a thermoplastic sheet, heating it to a specific temperature, and then vacuum forming it into a desired pattern. This innovative approach enhances the aesthetic and functional qualities of thermoplastic components.

Career Highlights

Martin Aaron Butkovich is currently employed at GM Global Technology Operations, Inc. His work focuses on advancing technologies that improve manufacturing processes and product quality in the automotive industry.

Collaborations

He collaborates with various professionals in his field, including his coworker Thomas E. Houck, to drive innovation and enhance product development.

Conclusion

Martin Aaron Butkovich's contributions to thermoplastic technology through his patent demonstrate his commitment to innovation and excellence in his field. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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