Corning, NY, United States of America

Martin (Hai) Hu

This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Martin (Hai) Hu. Retrieved from https://idiyas.com/inventor/martin-(hai)-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Martin (Hai) Hu

Introduction: Martin (Hai) Hu is a pioneering inventor based in Corning, NY (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Martin (Hai) Hu holds several patents in the areas of advanced materials, optical technologies, and telecommunications, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Martin (Hai) Hu has worked tirelessly to develop cutting-edge solutions that have revolutionized industries. His keen insight and inventive spirit have led to the creation of products that have significantly impacted the way we live and work.

Collaborations: Throughout his career, Martin (Hai) Hu has collaborated with leading research institutions, universities, and technology companies to further his research and bring his inventions to life. His collaborative efforts have resulted in the development of innovative technologies that have set new industry standards.

Conclusion: Martin (Hai) Hu's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary inventor. His work continues to inspire future generations of inventors and shape the landscape of technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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