Riemerling, Germany

Markus Huber

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Asmpt Gmbh & Co. Kg. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Markus Huber. Retrieved from https://idiyas.com/inventor/markus-huber-g8c5p4pz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Markus Huber

Introduction

Markus Huber is a notable inventor based in Riemerling, Germany. He has made significant contributions to the field of electronic component placement technology. His innovative designs have paved the way for advancements in automated assembly processes.

Latest Patents

Markus Huber holds a patent for a "Placement head with two rotor arrangements with individually actuatable handling devices." This invention is designed for automatically placing electronic components on a component carrier. The placement head features a chassis, a first rotor assembly that is rotatable about a first axis, and a second rotor assembly that is rotatable about a second axis. Each handling device includes a sleeve for attaching a component holding device, along with a drive device for movement and rotation.

Career Highlights

Markus Huber is currently associated with Asmpt GmbH & Co. KG, where he continues to innovate in the field of electronic assembly. His work has been instrumental in enhancing the efficiency and precision of component placement in manufacturing processes.

Collaborations

Throughout his career, Markus has collaborated with esteemed colleagues such as Karl-Heinz Besch and Thomas Bliem. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Markus Huber's contributions to the field of electronic component placement are noteworthy. His innovative patent and collaborative efforts highlight his commitment to advancing technology in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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