Company Filing History:
Years Active: 2016-2020
Title: Mark Tiam Weng Lam: Innovator in Electronic Module Quality Control
Introduction
Mark Tiam Weng Lam is a notable inventor based in Singapore, SG. He has made significant contributions to the field of electronic module packaging and quality control. With a total of 2 patents, his work focuses on improving the reliability and performance of electronic modules.
Latest Patents
Mark's latest patents include a groundbreaking screening methodology designed to eliminate wire sweep in bond and assembly module packaging. This innovative approach involves a series of tests performed on manufactured electronic modules, which are sensitive to the failure rate of previously tested modules. The first test consists of two phases conducted on the module batch. If a wire sweep failure is detected in a subset of failed modules from the first test phase, further screening is performed on modules that passed the first test phase, excluding those that failed.
Career Highlights
Mark Tiam Weng Lam is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in electronic module quality control.
Collaborations
Throughout his career, Mark has collaborated with talented individuals such as Stephen Peter Ayotte and Michael Russell Uy Gonzales. These collaborations have fostered a creative environment that encourages innovation and problem-solving.
Conclusion
Mark Tiam Weng Lam is a distinguished inventor whose work in electronic module quality control has led to significant advancements in the field. His innovative patents and collaborations with other professionals highlight his commitment to improving technology and ensuring reliability in electronic modules.