Forest Grove, OR, United States of America

Mark Sherman Keown

This inventor holds 1 USPTO granted patent. Top assignee: Nec America, Inc.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark Sherman Keown. Retrieved from https://idiyas.com/inventor/mark-sherman-keown

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Mark Sherman Keown: Innovator in Telecommunications Equipment

Introduction

Mark Sherman Keown is a notable inventor based in Forest Grove, Oregon. He has made significant contributions to the field of telecommunications through his innovative designs. His work focuses on creating efficient and compact solutions for telecommunications equipment.

Latest Patents

Mark Keown holds a patent for a densely packed telecommunications equipment enclosure. This enclosure is designed to be placed outdoors at remote locations and houses various equipment to provide a large number of voice channels. It includes an AC power supply, an AC/DC distribution panel, protector panels, a back-up battery plant, multiplexers, a fiber distribution panel, and a separate cable splice area. The enclosure is configurable to meet customers' requirements and is remarkably small and densely packed relative to its channel capacity.

Career Highlights

Mark Keown is associated with NEC America, Inc., where he continues to develop innovative telecommunications solutions. His work has been instrumental in advancing the capabilities of telecommunications infrastructure.

Collaborations

Mark has collaborated with talented individuals such as Casey Martin Bardue and John Reed Hannig, contributing to the success of various projects within the company.

Conclusion

Mark Sherman Keown's contributions to telecommunications equipment design highlight his innovative spirit and dedication to improving communication technologies. His patent for a densely packed telecommunications equipment enclosure exemplifies his commitment to efficiency and customer satisfaction.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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