Newton Center, MA, United States of America

Mark S Hoffman


Average Co-Inventor Count = 1.3

ph-index = 4

Forward Citations = 55(Granted Patents)


Location History:

  • Newton Center, MA (US) (1979 - 1988)
  • Burlington, MA (US) (2004)

Company Filing History:


Years Active: 1979-2004

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4 patents (USPTO):Explore Patents

Title: Mark S Hoffman: Innovator in Circuit Board Technology

Introduction

Mark S Hoffman is a notable inventor based in Newton Center, MA (US). He has made significant contributions to the field of electronic components, holding a total of 4 patents. His innovative designs focus on enhancing the efficiency and functionality of circuit boards.

Latest Patents

Hoffman's latest patents include a "Circuit board cover with exhaust apertures for cooling electronic components." This invention features a cover that attaches to a circuit board, equipped with an inlet for receiving forced air and multiple openings on its top surface. This design allows heat sinks mounted on the circuit board to extend partially through the openings, facilitating airflow to cool heat dissipative components effectively. Another notable patent is "Relay multiplexing for circuit testers." This invention involves relay multiplexer circuitry that connects a limited number of test channels to a large number of test pins through relays. Each test pin node can connect to a unique combination of test channel nodes, optimizing channel usage and minimizing conflict.

Career Highlights

Mark S Hoffman is currently employed at Teradyne, Inc., where he continues to innovate in the field of electronic testing and circuit design. His work has significantly impacted the efficiency of circuit testing processes.

Collaborations

Some of his coworkers include David C Drahms and Joseph Francis Wrinn, who contribute to the collaborative environment at Teradyne, Inc.

Conclusion

Mark S Hoffman is a distinguished inventor whose work in circuit board technology has led to several important patents. His contributions continue to shape the future of electronic components and testing methodologies.

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