This inventor holds 1 USPTO granted patent. Top assignee: Maxtor Corporation. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Mark R Lanciault: Innovator in Circuit Assembly Technology
Introduction
Mark R Lanciault is a notable inventor based in Foxborough, MA (US). He has made significant contributions to the field of circuit assembly technology. His innovative approach focuses on effectively dissipating heat generated by integrated circuits, which is crucial for enhancing the performance and reliability of electronic devices.
Latest Patents
Mark R Lanciault holds a patent for a "Thermally-enhanced circuit assembly." This invention involves a circuit assembly designed for mounting one or more integrated circuits while efficiently managing heat dissipation. The assembly comprises a substrate with an opening, a thermally-conductive adhesive layer, and a heat-dissipating layer. The integrated circuit is mounted on the substrate's first surface, coinciding with the opening, while the heat-dissipating layer is positioned on the second surface, featuring a raised portion that extends through the substrate's opening. This innovative design enhances the thermal management of integrated circuits, thereby improving their performance.
Career Highlights
Mark R Lanciault is associated with Maxtor Corporation, where he has contributed to various projects and innovations. His work in the field of circuit assembly has positioned him as a key figure in advancing technology related to electronic components.
Collaborations
Throughout his career, Mark has collaborated with several professionals, including Mark R Dunbar and Stanislaw Dobosz. These collaborations have fostered an environment of innovation and creativity, leading to advancements in circuit assembly technology.
Conclusion
Mark R Lanciault's contributions to circuit assembly technology exemplify the importance of innovation in the electronics industry. His patent for a thermally-enhanced circuit assembly showcases his commitment to improving the performance and reliability of integrated circuits. His work continues to influence the field and inspire future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile