Ewing, NJ, United States of America

Mark R Burhop

This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Siemens Product Lifestyle Management Inc.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark R Burhop. Retrieved from https://idiyas.com/inventor/mark-r-burhop

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Mark R. Burhop – Innovator in Additive Manufacturing Support Structures

Introduction

Mark R. Burhop, an inventive mind located in Ewing, NJ, has made significant contributions to the field of additive manufacturing. With a keen understanding of engineering and design principles, he has developed innovative solutions that enhance the production of solid models, ultimately advancing the capabilities of 3D printing technology.

Latest Patents

Mr. Burhop holds a notable patent titled "Support Structures for Additive Manufacturing of Solid Models." This patent outlines a method that involves receiving a solid model for a physical object that incorporates multiple boundary representation surfaces. The process includes analyzing these surfaces to generate point samples for potential support locations, clustering these points on the solid model, and creating column supports that connect to the original model at designated support locations. The innovative approach ensures that solid models can be effectively manufactured, maintaining structural integrity during the printing process.

Career Highlights

Mark R. Burhop is a vital member of Siemens Product Lifecycle Management Inc., where he applies his engineering expertise to foster advancements in product development and manufacturing technologies. His work at Siemens emphasizes innovation and collaboration, contributing to the evolution of smart manufacturing solutions.

Collaborations

Throughout his career, Mr. Burhop has collaborated with talented professionals such as David Madeley and Suraj Ravi Musuvathy. These partnerships have further enriched his contributions to the field, showcasing the importance of teamwork and knowledge-sharing in driving innovative solutions.

Conclusion

Mark R. Burhop exemplifies the spirit of innovation within the realm of additive manufacturing. His patent for support structures is just one example of how inventors can impact technology and manufacturing processes. As he continues his work at Siemens, his contributions will undoubtedly pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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