Mark R Brinthaupt, Iii

Title: Mark R Brinthaupt, III: Innovator in Circuit Board Technology

Introduction

Mark R Brinthaupt, III is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of circuit board technology, particularly through his innovative designs that enhance the functionality and efficiency of electronic devices.

Latest Patents

Mark holds a patent for a "Hybrid surface mount and pin thru hole circuit board." This multi-layer circuit board features a plurality of conductive planes and plated through hole sets. Each set comprises one or more plated through holes, with none to all of the plated through holes contacting at least one conductive plane. The design includes a thermal break around each plated through hole and thermal vents in the vicinity of each plated through hole. Additionally, surface mount technology pads are provided on the top surface of the circuit board. This invention showcases Mark's commitment to advancing circuit board technology.

Career Highlights

Mark is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to the field of electronics. His work at IBM has allowed him to collaborate with other talented professionals and push the boundaries of technology.

Collaborations

Some of Mark's coworkers include Lisa Jeanine Jimarez and William F Wildey. Their collaborative efforts contribute to the innovative environment at IBM, fostering advancements in technology.

Conclusion

Mark R Brinthaupt, III is a distinguished inventor whose work in circuit board technology has made a lasting impact. His patent for a hybrid circuit board exemplifies his innovative spirit and dedication to improving electronic design.