San Ramon, CA, United States of America

Mark Honstra


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Mark Honstra - Innovator in Expansion Joint Technology

Introduction

Mark Honstra is a notable inventor based in San Ramon, CA (US). He has made significant contributions to the field of structural engineering, particularly with his innovative designs for expansion joints. His work has been recognized for its practicality and effectiveness in bridging gaps between structural sections.

Latest Patents

Mark Honstra holds a patent for an improved expansion joint assembly. This assembly is designed to bridge an expansion void between adjacent, relatively shiftable structural sections. The assembly includes a pair of supports secured to the sections, along with a bridging member that operatively engages the supports. A resilient compressible filler is located between the bridging member and adjacent portions of the supports. This filler is designed to accommodate significant movement without bulging or failure, showcasing Honstra's commitment to creating durable and efficient solutions. He has 1 patent to his name.

Career Highlights

Throughout his career, Mark has worked with several prominent companies, including Balco and Hexcel Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various projects that emphasize innovation in structural design.

Collaborations

Mark has collaborated with notable professionals in his field, including Glen Duckworth and Bill Heisterberg. These partnerships have further enhanced his work and contributed to the development of effective engineering solutions.

Conclusion

Mark Honstra's contributions to the field of expansion joint technology demonstrate his innovative spirit and dedication to engineering excellence. His patent and career achievements reflect his significant impact on structural engineering.

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