Hoboken, NJ, United States of America

Mark Hillman

This inventor holds 1 USPTO granted patent. Top assignee: Service Support Specialties, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark Hillman. Retrieved from https://idiyas.com/inventor/mark-hillman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mark Hillman and Semiconductor Processing Robotics.

Introduction

Mark Hillman is an inventor associated with Hoboken, New Jersey, and Service Support Specialties, Inc. His listed patent concerns semiconductor processing and robotic equipment designed to handle substrates.

Latest Patents

Hillman is credited with 1 patent: “Method and/or System for Processing a Substrate and Robot Apparatus Therefor.” The invention describes a semiconductor processing system, a method for processing semiconductors, and a robot apparatus. The apparatus includes two independently movable arms, each equipped with two end effectors, and drive mechanisms that move the arms along separate axes and together along a perpendicular third axis. This arrangement is intended to support substrate handling within semiconductor processing systems.

Career Highlights

Hillman’s listed patent reflects work on robotic mechanisms for semiconductor manufacturing. The design combines multiple end effectors with coordinated arm movement to support substrate processing operations.

Collaborations

The provided information lists Gary Hillman and Matthew Hoffer as Hillman’s coworkers. It does not specify their roles in the patent or describe any direct collaboration with him.

Conclusion

Mark Hillman’s recorded invention focuses on a multi-arm robot apparatus for semiconductor substrate processing, connecting his patent activity with specialized manufacturing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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