Wappingers Falls, NY, United States of America

Mark Esformes


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2020

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Mark Esformes: Innovator in Additive Layer Manufacturing

Introduction

Mark Esformes is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of additive layer manufacturing, particularly through his innovative patent. With a focus on creating porous structures, his work has implications for various industries.

Latest Patents

Mark Esformes holds a patent titled "Porous structures produced by additive layer manufacturing." This patent describes a method for forming three-dimensional structures by depositing layers of material onto a substrate. A high-energy beam is used to scan and partially melt each layer, resulting in a complex structure where segments overlap and underlap in a predetermined manner. This innovative approach enhances the capabilities of additive manufacturing.

Career Highlights

Esformes is associated with Howmedica Osteonics Corporation, where he applies his expertise in additive manufacturing. His work at the company reflects his commitment to advancing technology in the medical device sector. His innovative contributions have positioned him as a key figure in the field.

Collaborations

Throughout his career, Mark has collaborated with talented individuals such as Thomas Francis McCarthy and Brock Miller. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Mark Esformes is a pioneering inventor whose work in additive layer manufacturing has the potential to transform various industries. His patent on porous structures exemplifies his innovative spirit and dedication to advancing technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…