The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Dec. 15, 2015
Applicant:

Howmedica Osteonics Corp., Mahwah, NJ (US);

Inventors:

Thomas Francis McCarthy, Neshanic Station, NJ (US);

Brock Miller, Toronto, CA;

Robin Stamp, Montclair, NJ (US);

Yuri Zaitsev, Nyack, NY (US);

Robert Klein, Orangeburg, NY (US);

Mark Esformes, Wappingers Falls, NY (US);

David Markel, Southfield, MI (US);

Amit Mistry, Weston, FL (US);

Joseph Robinson, Ridgewood, NJ (US);

Assignee:

Howmedica Osteonics Corp., Mahwah, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B23K 1/00 (2006.01); B29C 67/00 (2017.01); B29C 64/153 (2017.01); A61L 27/56 (2006.01); B22F 3/11 (2006.01); B22F 3/105 (2006.01); B29C 64/135 (2017.01); A61F 2/00 (2006.01); B28B 1/00 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); A61F 2/0063 (2013.01); A61L 27/56 (2013.01); B22F 3/1055 (2013.01); B22F 3/1103 (2013.01); B28B 1/001 (2013.01); B29C 64/135 (2017.08); B29C 64/153 (2017.08); B29L 2031/772 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); Y02P 10/295 (2015.11);
Abstract

A three-dimensional structure is formed when layers of a material are deposited onto a substrate and scanned with a high energy beam to at least partially melt each layer of the material. Upon scanning the layers at predetermined locations at least a first segment overlapping a second segment and underlapping a third segment is formed.


Find Patent Forward Citations

Loading…