Chagrin Falls, OH, United States of America

Mark David Stultz


 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Stow, OH (US) (2020)
  • Chagrin Falls, OH (US) (2019 - 2024)

Company Filing History:


Years Active: 2019-2024

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Mark David Stultz

Introduction

Mark David Stultz is a notable inventor based in Chagrin Falls, Ohio. He has made significant contributions to the field of packaging technology, holding a total of five patents. His innovative methods have advanced the way packages are created and handled in various industries.

Latest Patents

One of Stultz's latest patents involves a packaging machine that utilizes an exemplary method of making packages. This method includes advancing a web of connected bags to a position where the opening of the bag is below an engagement device. The engagement device is then opened, and the opening of the bag is blown to a partially opened configuration. The web of connected bags is reverse indexed so that a portion of the engagement device is inside the bag while another portion is outside. Finally, the engagement device is closed to engage the bag, resulting in a rectangular shape for the bag's opening.

Career Highlights

Throughout his career, Mark David Stultz has worked with prominent companies in the packaging industry, including Automated Packaging Systems, Inc. and Sealed Air Corporation. His experience in these organizations has allowed him to refine his skills and contribute to innovative packaging solutions.

Collaborations

Stultz has collaborated with several professionals in his field, including Michael J. Riccardi and Robert S. Galosi. These collaborations have further enhanced his work and led to the development of advanced packaging technologies.

Conclusion

Mark David Stultz's contributions to packaging technology through his patents and career experiences highlight his role as an influential inventor. His innovative methods continue to shape the industry and improve packaging processes.

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