Ludwigshafen, Germany

Marion Schleicher

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Reckitt Benckiser N.v.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marion Schleicher. Retrieved from https://idiyas.com/inventor/marion-schleicher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Marion Schleicher: Inventor of a Shrink-Wrapped Compacted Composition Package

Introduction

Marion Schleicher is an inventor associated with Ludwigshafen, Germany. Her recorded patent work concerns a packaging process designed to hold a compacted particulate composition securely while supporting low friability and rapid dissolution. She is credited with 1 patent.

Latest Patents

Schleicher’s patent, “Process for the Preparation of a Package Containing Compacted Composition and the Package Obtained with This Process,” describes wrapping a compacted particulate composition in a first film and heating the wrapped composition so the film shrinks and clings to it. The process can produce packages using low compaction pressures, which may help reduce friability and allow the contents to dissolve quickly.

Career Highlights

Schleicher’s listed company affiliations include Reckitt Benckiser N.V. and Gunnar Noeding. Her patent reflects an applied innovation in packaging, combining film shrinkage with compacted particulate materials.

Collaborations

Her listed collaborators include Gunnar Noding and Frederic Moreux. These associations connect her patent work with colleagues involved in related innovation.

Conclusion

Marion Schleicher’s recorded invention focuses on a practical packaging method that uses heat-shrunk film to secure compacted compositions while aiming to preserve their durability and fast-dissolving properties.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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