Duderstadt, Germany

Mario Koppe

This inventor holds 1 USPTO granted patent. Top assignee: Ottobock Se & Co Kgaa. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mario Koppe. Retrieved from https://idiyas.com/inventor/mario-koppe-l7dr96qt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Mario Koppe

Introduction

Mario Koppe is an accomplished inventor based in Duderstadt, Germany. He has made significant contributions to the field of 3D scanning technology. His innovative approach has led to the development of a unique method that enhances the accuracy and efficiency of creating 3D scans of body parts.

Latest Patents

Mario Koppe holds a patent for a "Method for creating a 3D scan and contact element for such a method." This invention relates to a systematic approach for generating a 3D scan of a body part, which includes several critical steps that improve the scanning process. He has 1 patent to his name, showcasing his expertise in this specialized area.

Career Highlights

Mario is currently employed at Ottobock Se & Co. Kgaa, a leading company in the field of medical technology. His work at Ottobock has allowed him to apply his innovative ideas in practical settings, contributing to advancements in healthcare solutions.

Collaborations

Throughout his career, Mario has collaborated with talented individuals such as Julia Volkmar and Judith Wille. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Mario Koppe's contributions to the field of 3D scanning technology exemplify the impact of innovation in medical applications. His work continues to inspire advancements that improve patient care and outcomes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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