Santa Monica, CA, United States of America

Mario Gerla

This inventor holds 1 USPTO granted patent. Top assignee: Italtel Societa Italiana Telecomunicazioni. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mario Gerla. Retrieved from https://idiyas.com/inventor/mario-gerla-opa1uzgl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: The Innovations of Mario Gerla

Introduction

Mario Gerla is a notable inventor based in Santa Monica, California. He has made significant contributions to the field of telecommunications, particularly through his innovative patent work. His expertise and dedication to advancing technology have earned him recognition in the industry.

Latest Patents

Mario Gerla holds a patent for a "Passive optical network structure with high fault tolerance." This invention showcases his ability to enhance network reliability and efficiency, addressing critical challenges in telecommunications infrastructure.

Career Highlights

Gerla is currently employed at Italtel Societa Italiana Telecomunicazioni S.p.a., where he continues to develop cutting-edge solutions in the telecommunications sector. His work at Italtel has allowed him to collaborate with other talented professionals and contribute to the company's mission of delivering innovative communication technologies.

Collaborations

One of his notable coworkers is Guido Chiaretti, with whom he has likely shared insights and expertise in their field. Their collaboration exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Mario Gerla's contributions to telecommunications through his patent and work at Italtel highlight his role as an influential inventor. His innovative spirit continues to shape the future of communication technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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