Company Filing History:
Years Active: 2024
Title: The Innovations of Mario Arwin Simon Fabian
Introduction
Mario Arwin Simon Fabian is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a patent that addresses critical challenges in semiconductor packaging.
Latest Patents
Mario holds a patent for "Reliable semiconductor packages." This patent discloses semiconductor packages and methods for forming them. The semiconductor package includes a package substrate with a die attach region where a die is attached. A protective cover is placed over a sensor region of the die and is secured to the die using a cover adhesive. This cover adhesive also functions as a standoff structure, supporting the protective cover. The standoff structure is designed to create multiple cavities beneath the protective cover, which helps to reduce thermal stress on the cover. An encapsulant is applied to cover the package substrate while leaving the top surface of the package exposed.
Career Highlights
Mario is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the reliability and performance of semiconductor packages.
Collaborations
Some of his coworkers include Dennis Fernandez Tresnado and Wedanni Linsangan Micla, who contribute to the collaborative environment at Utac Headquarters Pte. Ltd.
Conclusion
Mario Arwin Simon Fabian's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a deep understanding of the challenges in the field and offers practical solutions to enhance semiconductor reliability.