Company Filing History:
Years Active: 2021
Title: Innovations by Mario Arwin Fabian in Semiconductor Packaging
Introduction
Mario Arwin Fabian is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a reliable method for forming semiconductor packages.
Latest Patents
Mario holds 1 patent for his invention titled "Reliable semiconductor packages." This patent discloses a method that includes providing a package substrate with top and bottom major surfaces. The method involves attaching a die onto a die attach region and applying a cover adhesive to enhance the package's reliability. The protective cover is designed to ensure that the die active region is adequately protected while improving adhesion with the encapsulant.
Career Highlights
Mario Arwin Fabian is currently employed at Utac Headquarters Pte. Ltd. His work focuses on advancing semiconductor technologies and improving packaging methods. His expertise in this area has positioned him as a valuable asset to his company.
Collaborations
Throughout his career, Mario has collaborated with notable colleagues, including Hua Hong Tan and Chee Kay Chow. These collaborations have fostered innovation and contributed to the success of their projects.
Conclusion
Mario Arwin Fabian's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement in technology that enhances the reliability of semiconductor packages.